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BS PD IEC TR 61760-3-1:2022

$121.92

Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
standard by BSI Group, 10/31/2022

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Description

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:
10/31/2022
ISBN(s):
9780539179361
Number of Pages:
30
File Size:
1 file , 2.4 MB
Product Code(s):
30438361, 30438361, 30438361
Note:
This product is unavailable in Ukraine, Russia, Belarus

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